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Single-Step Microcircuit Enclosure

Microsystems require environmental protection for high reliability and long-term operation. The Single-Step Microcircuit Enclosure provides a cost-efficient method of sealing microsystems against damaging external environments. This new cover, which consists of nickel and gold plated Kovar with an attached solder preform, replaces the seal ring and lid attachment processes and reduces hermetic sealing to a single-step process. The cover protects the active components and is attached to Low Temperature Cofired Ceramic (LTCC) network using a standard single-step manufacturing process.

Microcircuit 1While the new enclosure requires only a single-step process to achieve a hermetic seal, the actual sealing techniques are substantially conventional.
Microcircuit 2

This enclosure also meets military standards for temperature extremes and mechanical shock and vibration.

ADVANTAGES:Microcircuit 3
-One robust solder joint reduces the risk for hermetic cavity leaks.
-The single-piece enclosure reduces processing time and improves process yields.
-A smaller microcircuit is possible because the area needed to accommodate the single-piece enclosure is reduced; this results with a higher level of integration.


PATENT STATUS:
The enclosure is Patent Pending under serial number 10/774,926.

Additional Details

Owner

Honeywell

Intellectual Property Protection

Pending Patent



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